By John Lau, Cheng Lee, C. Premachandran, Yu Aibin

ISBN-10: 0071626239

ISBN-13: 9780071626231

A finished consultant to 3D MEMS packaging tools and recommendations Written via specialists within the box, complex MEMS Packaging serves as a beneficial reference for these confronted with the demanding situations created via the ever-increasing curiosity in MEMS units and packaging. This authoritative consultant provides state-of-the-art MEMS (microelectromechanical structures) packaging ideas, corresponding to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you decide trustworthy, artistic, high-performance, strong, and in your price range packaging innovations for MEMS units. The booklet also will relief in stimulating additional examine and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, methods, production, trying out, and reliability. one of the issues explored: complicated IC and MEMS packaging developments MEMS units, advertisement purposes, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding suggestions Actuation mechanisms and built-in micromachining Bubble change, optical change, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

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Miniature package for translation of sensor sense axis,” MacGugan, Douglas C. (US), EP1785392 (A2)—2007-05-16. 96. “Method for integrated MEMS packaging,” Hartzell, John W. (US), Walton, Harry G. (GB) (+1), US2007099327 (A1)—200705-03. 97. “Systems and methods of testing micro-electromechanical devices,” Miles, Mark W. (US), US2007097134 (A1)—2007-05-03. 98. “Microphone and manufacturing method thereof,” Jang, Jau-Jr (TW), Tsai, Tzuen-Yi (TW) (+1), TW262735 (B)—2006-09-21. 99. “MEMS (micro electronic mechanical system) package and its manufacturing method,” Tenmyo, Hiroyuki, Isada, Naoya (+4), JP2007088189 (A)—2007-04-05.

88. “MEMS module package and packaging method,” Lee, Yeong Gyu (KR), KR20070042244 (A)—2007-04-23. 89. “MEMS device package and packaging method,” Kim, Dae Jun (KR), Lee, Yeong Gyu (KR) (+1), KR20070040472 (A)— 2007-04-17. 90. “MEMS device package and packaging method,” Kim, Dae Jun (KR), Lee, Yeong Gyu (KR) (+1), KR20070040471 (A)— 2007-04-17. 91. “MEMS module and packaging method,” Lee, Yeong Gyu (KR), KR20070040033 (A)—2007-04-16. 92. “Method for adjusting the frequency of a MEMS resonator,” Lutz, Aaron, Partridge, Markus (DE), CN1977448 (A)—200706-06.

80. “Packaging structure of MEMS microphone,” Park, Sung Ho (KR), Lim, Jun (KR) (+1), KR100737726 (B1)—2007-07-04. 81. “Packaging structure of MEMS microphone and construction method thereof,” Choo, Yun Jai (KR), Park, Peter (KR) (+1), KR100737728 (B1)—2007-07-04. 82. “Method of packaging of MEMS device at the vacuum state using a silicide bonding,” Lee, Ho Young (KR), Cho, Sung Woo (KR), KR20070078239 (A)—2007-07-31. 83. “Method of packaging of MEMS device at the vacuum state using a silicide bonding and vacuum packaged MEMS device using the same,” Lee, Ho Young (KR), Cho, Sung Woo (KR), KR20070078233 (A)—2007-07-31.

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Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin

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